A European GaN transistor supply chain

Strategic innovation for a competitive space sector

Gallium nitride (GaN) power device technology is essential for enabling power converters to withstand high radiation in space while improving power efficiency, density and frequency. As such, it is vital for space applications. In this context, the EU-funded ESGAN project aims to develop an innovative 200V enhancement-mode GaN transistor for use in power management circuits in space. The initiative will leverage the benefits of GaN, such as increased efficiency and reduced mass, while working together with a consortium of European partners across the supply chain. This collaboration aims to drive innovation and enhance European competitiveness in this field.

satellite flying on space

Technical Objective

Devices will be designed, produced, tested for radiation effects, thermal effects, structural effects and reliability performance and will be demonstrated in an application to verify the desired performance. The end goal will be to proceed with a space evaluation leading to a space qualification of the produced devices.

Revolutionizing Power for Space with GaN Technology

ESGAN is developing a 200V enhancement-mode GaN transistor (normally off) for space power management systems—offering key advantages like reduced mass, higher efficiency, and superior radiation resistance.

Earth above the lunar surface

Supply Chain Objective

To achieve the goals of the project a strong consortium has been established in which the members cover each of the stages of the supply chain. The consortium is composed of the following companies.

European Autonomy in Space Electronics

A key goal of the ESGAN project is to eliminate reliance on non-European suppliers by establishing a robust, end-to-end European supply chain for GaN transistor technology. This is made possible through a committed consortium of leaders in materials, design, manufacturing, and system integration.

photo of moon surface

Develop a space-qualified 200V enhancement-mode GaN transistor

Test for radiation, thermal, structural, and reliability performance

Demonstrate the device in a real space application

Establish a fully European, end-to-end supply chain

Enhance European strategic independence in space technology

earth photo

Collaboration by Industry Leaders

Our four companies join their complementary strengths

The ambitious EsGaN goals are possible thanks to the cumulated expertise of our members in all the involved technologies. The consortium is composed of a company devoted to space level GaN transistors.

AIXTRON, a company dedicated to the design and manufacture of equipment to grow advanced substrates for GaN transistors. SEMI ZABALA, a company dedicated to the design, test and packaging of GaN transistors and integrated circuits. X-FAB, a semiconductor foundry company that has developed and offers processing services for GaN transistors. AIRBUS DEFENCE & SPACE, are one of Europe´s leading companies dedicated to the design and manufacture of satellite equipment and systems.

The consortium covers an end to end supply chain from materials, design, processing, packaging and test through to end users.

astronaut in spacesuit floating in space

Development Phases

A close-up view of a green printed circuit board with various electronic components, including a black integrated circuit chip in the center. The circuit board has multiple silver solder points and white printed labels such as 'Driver'.
A close-up view of a green printed circuit board with various electronic components, including a black integrated circuit chip in the center. The circuit board has multiple silver solder points and white printed labels such as 'Driver'.

Design & Fabrication of GaN devices

At the heart of ESGAN lies the development of a 200V enhancement-mode GaN transistor, also known as a normally-off device—critical for safety and reliability in power management systems. This phase includes:

  • Device architecture and modeling to optimize performance under extreme conditions

  • Material growth and substrate preparation, using advanced metal-organic chemical vapor deposition (MOCVD) techniques

  • Wafer processing and device fabrication in cleanroom facilities

  • Packaging solutions tailored for thermal management and radiation shielding in space

A close-up side view of an electronic circuit board featuring a prominent black heat sink with vertical fins. The board contains small electronic components, including resistors and capacitors, with a blurred background.
A close-up side view of an electronic circuit board featuring a prominent black heat sink with vertical fins. The board contains small electronic components, including resistors and capacitors, with a blurred background.

Testing for radiation and environmental resilience

Given the harsh environment of space, the developed devices must be thoroughly tested for robustness against:

  • Radiation Effects – Total Ionizing Dose (TID), Single Event Effects (SEE), and Displacement Damage

  • Thermal Cycling – Performance at extreme temperatures from -150°C to +125°C

  • Mechanical Stress – Including vibration and shock tests

  • Electrical Reliability – Long-term performance under voltage and current stress

A close-up side view of an electronic circuit board featuring a prominent black heat sink with vertical fins. The board contains small electronic components, including resistors and capacitors, with a blurred background.
A close-up side view of an electronic circuit board featuring a prominent black heat sink with vertical fins. The board contains small electronic components, including resistors and capacitors, with a blurred background.

Demonstration in space application

Once the GaN devices have passed lab testing, they are integrated into a functional power management system for real-world demonstration. This stage focuses on:

  • Building a prototype power converter using ESGAN devices

  • Verifying system-level benefits: increased efficiency, reduced volume and weight

  • Simulating or conducting testing under space-representative conditions

  • Preparing data to support the space qualification process

A close-up side view of an electronic circuit board featuring a prominent black heat sink with vertical fins. The board contains small electronic components, including resistors and capacitors, with a blurred background.
A close-up side view of an electronic circuit board featuring a prominent black heat sink with vertical fins. The board contains small electronic components, including resistors and capacitors, with a blurred background.

The final goal is to achieve space evaluation and qualification, allowing the technology to be deployed on actual space missions. This phase includes:

  • Compiling a complete reliability and qualification report

  • Demonstrating compliance with European Space Agency (ESA) standards

  • Final review by space qualification authorities

  • Transfer to industrialization for future commercial applications

Evaluation & Qualification for space missions

view of Earth and satellite

Innovative Semiconductor Solutions

We design and manufacture high-performance semiconductor devices for power electronics applications.

Demanding missions
A close-up view of a semiconductor wafer, featuring a grid pattern of many microchips. The surface reflects light in various iridescent colors, highlighting intricate electronic circuits and layers. The image emphasizes precision engineering and technological complexity.
A close-up view of a semiconductor wafer, featuring a grid pattern of many microchips. The surface reflects light in various iridescent colors, highlighting intricate electronic circuits and layers. The image emphasizes precision engineering and technological complexity.

As the industry advances, satellite platforms and payloads require power systems to become lighter and more energy efficient.

A printed circuit board with various electronic components and integrated circuits, prominently featuring a large black chip labeled 'PHOENIX ICU PRG 0770Z1-1'. Several capacitors are visible, along with numerous small resistors and connectors. There is a green LED light illuminated on the board, and the surface is covered with intricate traces and solder points.
A printed circuit board with various electronic components and integrated circuits, prominently featuring a large black chip labeled 'PHOENIX ICU PRG 0770Z1-1'. Several capacitors are visible, along with numerous small resistors and connectors. There is a green LED light illuminated on the board, and the surface is covered with intricate traces and solder points.
A close-up view of electronic components on a circuit board, including capacitors, inductors, and semiconductor chips. The components are densely packed, with visible QR codes on some of the parts. The circuit board is part of a larger electronic device with a metallic enclosure.
A close-up view of electronic components on a circuit board, including capacitors, inductors, and semiconductor chips. The components are densely packed, with visible QR codes on some of the parts. The circuit board is part of a larger electronic device with a metallic enclosure.
Advanced technology

Enhanced transistors made of gallium nitride (GaN) offer superior performance over traditional silicon components.

We are creating the first European supply chain of gallium nitride transistors to be used specifically in space applications.

Made in Europe